⚡ GaN III fast-charging technology OEM / ODM welcome — low MOQ Worldwide shipping & certification support
GaN fast-charging technology
Technology

The technology inside every Rongjun charger.

Self-developed GaN chips, an ultra-thin PCBA, and full protocol support — engineered for efficiency, safety and speed.

Rongjun ultra-thin GaN charger
Up to 50% slimmer vs. traditional silicon chargers
GaN III

Our own silicon, our own design.

We develop our own GaN main chips and PCBA. A proprietary one-piece transformer lets us re-engineer the board into an ultra-thin flat “biscuit” shape — delivering full-power charging in the slimmest form factor, with less heat and higher efficiency than off-the-shelf silicon.

Self-developed GaN chipsOwn silicon, better efficiency & cost
One-piece transformerEnables the ultra-thin biscuit PCBA
Superior thermal controlRuns cooler at full load
Higher efficiencyStable output, no power reduction
Charging protocols

Speaks every fast-charging language

USB-C PD 3.1

The latest USB Power Delivery standard — up to 140W over a single USB-C port for phones, tablets and laptops.

PPS

Programmable Power Supply fine-tunes voltage and current in real time (20mV steps) for faster, cooler, more efficient charging.

Quick Charge

Broad compatibility with Qualcomm Quick Charge devices, alongside Apple and Samsung fast-charge profiles.

Multi-protocol & multi-port

Intelligent power distribution across USB-C and USB-A ports, auto-detecting each device for its optimal charge.

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Safety & testing

Built safe, tested 100%

Multi-protection circuit

Over-voltage, over-current, over-temperature, short-circuit and surge protection built into every board.

Aging test

Every unit runs under sustained load to verify long-term stability before it leaves the line.

Hi-pot test

High-potential dielectric testing confirms electrical insulation and user safety on 100% of production.

Thermal management

GaN efficiency plus optimized layout keeps surface temperatures low, even at full multi-port output.